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© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 03 — 2 June 2005

13 of 16

Philips Semiconductors

74ALVT16827

20-bit buffer/line driver; non-inverting; 3-state

Fig 9.

Package outline SOT364-1 (TSSOP56)

UNIT

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.2

0.1

8

0

o

o

0.1

DIMENSIONS (mm are the original dimensions).

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

SOT364-1

99-12-27

03-02-19

θ

A

D

Q

detail X

E

Z

e

c

L

X

(A )

3

0.25

128

56

29

y

pin 1 index

b

H

1.05

0.85

0.28

0.17

0.2

0.1

14.1

13.9

6.2

6.0

0.5

1

8.3

7.9

0.50

0.35

0.5

0.1

0.08

0.25

0.8

0.4

p

E

A

TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm

SOT364-1

A

max.

1.2

0

2.5

5 mm

scale

MO-153