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MAX503CAG Datasheet(PDF) 15 Page - Maxim Integrated Products |
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MAX503CAG Datasheet(HTML) 15 Page - Maxim Integrated Products |
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15 / 16 page ![]() 5V, Low-Power, Parallel-Input, Voltage-Output, 10-Bit DAC ______________________________________________________________________________________ 15 33µF REFIN REFOUT AGND DGND REFGND ROFS RFB VOUT VOUT -5V +5V MAX503 Figure 11. Bipolar Configuration (-2.048V to +2.048V Output) Figure 12. Four-Quadrant Multiplying Circuit REFGND AGND DGND REFIN VDD VSS ROFS RFB VOUT VOUT -5V +5V REFIN MAX503 __________Applications Information Single-Supply Linearity As with any amplifier, the MAX503’s output op amp off- set can be positive or negative. When the offset is posi- tive, it is easily accounted for. However, when the offset is negative, the output cannot follow linearly when there is no negative supply. In that case, the amplifier output (VOUT) remains at ground until the DAC voltage is suffi- cient to overcome the offset and the output becomes positive. The resulting transfer function is shown in Figure 13. Normally, linearity is measured after allowing for zero error and gain error. Since, in single-supply operation, the actual value of a negative offset is unknown, it can- not be accounted for during test. In the MAX503, linear- ity and gain error are measured from code 3 to code 1023 (see Note 2 under Electrical Characteristics). The output amplifier offset does not affect monotonicity, and these DACs are guaranteed monotonic starting with code zero. In dual-supply operation, linearity and gain error are measured from code 0 to 1023. Power-Supply Bypassing and Ground Management Best system performance is obtained with printed cir- cuit boards that use separate analog and digital ground planes. Wire-wrap boards are not recommended. The two ground planes should be connected together at the low-impedance power-supply source. AGND and REFGND should be connected together, and then to DGND at the chip. For single-supply appli- cations, connect VSS to AGND at the chip. The best ground connection may be achieved by connecting the AGND, REFGND, and DGND pins together and connecting that point to the system analog ground plane. If DGND is connected to the system digital ground, digital noise may get through to the DAC’s ana- log portion. Bypass VDD (and VSS in dual-supply mode) with a 0.1µF ceramic capacitor connected between VDD and AGND (and between VSS and AGND). Mount the capacitors with short leads close to the device. AC Considerations Digital Feedthrough High-speed data at any of the digital input pins may couple through the DAC package and cause internal stray capacitance to appear as noise at the DAC out- put, even though LDAC and CS are held high (see Typical Operating Characteristics). This digital feedthrough is tested by holding LDAC and CS high and toggling the data inputs from all 1s to all 0s. Analog Feedthrough Because of internal stray capacitance, higher-frequen- cy analog input signals at REFIN may couple to the output, even when the input digital code is all 0s, as shown in the Typical Operating Characteristics graph Analog Feedthrough vs. Frequency. It is tested by set- ting CLR to low (which sets the DAC latches to all 0s) and sweeping REFIN. |
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