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IRS2168D Datasheet(PDF) 2 Page - International Rectifier |
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IRS2168D Datasheet(HTML) 2 Page - International Rectifier |
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2 / 21 page ![]() IRS2168D(S)PbF www.irf.com Page 2 Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defned positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units V B VB pin high-side floating supply voltage -0.3 625 V S VS pin high-side floating supply offset voltage VB – 25 VB + 0.3 V HO HO pin high-side floating output voltage VS - 0.3 VB + 0.3 V LO LO pin low-side output voltage V PFC PFC gate driver output voltage -0.3 VCC + 0.3 V IO, MAX Maximum allowable output current (HO, LO, PFC) due to external power transistor miller effect -500 500 ICC VCC current (see Note 1) -25 25 mA V BUS VBUS pin voltage V CPH CPH pin voltage V COMP COMP pin voltage VZX ZX pin voltage VOC OC pin voltage V SD/EOL SD/EOL pin voltage V CS CS pin voltage -0.3 VCC + 0.3 V V VCO VCO pin voltage -0.3 6 V ICPH CPH pin current I VCO VCO pin current I FMIN FMIN pin current I COMP COMP pin current I ZX ZX pin current I OC OC pin current I SD/EOL SD/EOL pin current I CS CS pin current -5 5 mA dV/dt Allowable VS pin offset voltage slew rate -50 50 V/ns Package power dissipation @ TA ≤ +25 ºC (16-Pin DIP) --- 1.8 P D PD = (T JMAX-TA)/RθJA (16-Pin SOIC) --- 1.4 W (16-Pin DIP) --- 70 RθJA Thermal resistance, junction to ambient (16-Pin SOIC) --- 86 ºC/W T J Junction temperature -55 150 T S Storage temperature -55 150 T L Lead temperature (soldering, 10 seconds) --- 300 ºC Note 1: This IC contains a Zener clamp structure between the chip VCC and COM which has a nominal breakdown voltage of 15.6 V. This supply pin should not be driven by a DC, low impedance power source greater than the VCLAMP specified in the Electrical Characteristics section. |
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