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PIC16C765/SP Datasheet(PDF) 149 Page - Microchip Technology

Part # PIC16C765/SP
Description  8-Bit CMOS Microcontrollers with USB
PDF  158 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC16C765/SP Datasheet(HTML) 149 Page - Microchip Technology

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© 1999 Microchip Technology Inc.
Advanced Information
DS41124A-page 149
PIC16C745/765
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
1.14
0.89
0.64
.045
.035
.025
CH
Pin 1 Corner Chamfer
1.00
.039
(F)
Footprint (Reference)
(F)
A
A1
A2
α
E
E1
#leads=n1
p
B
D1
D
n
1
2
φ
c
β
L
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
44
44
Pitch
p
.031
0.80
Overall Height
A
.039
.043
.047
1.00
1.10
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
A1
.002
.004
.006
0.05
0.10
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Foot Angle
φ
03.5
7
0
3.5
7
Overall Width
E
.463
.472
.482
11.75
12.00
12.25
Overall Length
D
.463
.472
.482
11.75
12.00
12.25
Molded Package Width
E1
.390
.394
.398
9.90
10.00
10.10
Molded Package Length
D1
.390
.394
.398
9.90
10.00
10.10
Pins per Side
n1
11
11
Lead Thickness
c
.004
.006
.008
0.09
0.15
0.20
Lead Width
B
.012
.015
.017
0.30
0.38
0.44
Mold Draft Angle Top
α
510
15
5
10
15
Mold Draft Angle Bottom
β
510
15
5
10
15
CH x 45
°
*Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076



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