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PIC17LC44-08/P Datasheet(PDF) 149 Page - Microchip Technology |
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PIC17LC44-08/P Datasheet(HTML) 149 Page - Microchip Technology |
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149 / 240 page ![]() © 1996 Microchip Technology Inc. DS30412C-page 149 PIC17C4X Applicable Devices 42 R42 42A 43 R43 44 17.1 DC CHARACTERISTICS: PIC17C42-16 (Commercial, Industrial) PIC17C42-25 (Commercial, Industrial) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40˚C ≤ TA ≤ +85˚C for industrial and 0˚C ≤ TA ≤ +70˚C for commercial Parameter No. Sym Characteristic Min Typ† Max Units Conditions D001 VDD Supply Voltage 4.5 – 5.5 V D002 VDR RAM Data Retention Voltage (Note 1) 1.5 * – – V Device in SLEEP mode D003 VPOR VDD start voltage to ensure internal Power-on Reset signal –VSS – V See section on Power-on Reset for details D004 SVDD VDD rise rate to ensure internal Power-on Reset signal 0.060* – – mV/ms See section on Power-on Reset for details D010 D011 D012 D013 D014 IDD Supply Current (Note 2) – – – – – 3 6 11 19 95 6 12 * 24 * 38 150 mA mA mA mA µA FOSC = 4 MHz (Note 4) FOSC = 8 MHz FOSC = 16 MHz FOSC = 25 MHz FOSC = 32 kHz WDT enabled (EC osc configuration) D020 D021 IPD Power-down Current (Note 3) – – 10 < 1 40 5 µA µA VDD = 5.5V, WDT enabled VDD = 5.5V, WDT disabled * These parameters are characterized but not tested. † Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD or VSS, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. Current consumed from the oscillator and I/O’s driving external capacitive or resistive loads need to be con- sidered. For the RC oscillator, the current through the external pull-up resistor (R) can be estimated as: VDD / (2 • R). For capacitive loads, The current can be estimated (for an individual I/O pin) as (CL • VDD) • f CL = Total capacitive load on the I/O pin; f = average frequency on the I/O pin switches. The capacitive currents are most significant when the device is configured for external execution (includes extended microcontroller mode). 3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, all I/O pins in hi-impedance state and tied to VDD or VSS. 4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti- mated by the formula IR = VDD/2Rext (mA) with Rext in kOhm. |
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