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PIC17LC44-08/P Datasheet(PDF) 152 Page - Microchip Technology |
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PIC17LC44-08/P Datasheet(HTML) 152 Page - Microchip Technology |
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152 / 240 page ![]() PIC17C4X DS30412C-page 152 © 1996 Microchip Technology Inc. Applicable Devices 42 R42 42A 43 R43 44 DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40˚C ≤ TA ≤ +40˚C Operating voltage VDD range as described in Section 17.1 Parameter No. Sym Characteristic Min Typ† Max Units Conditions Internal Program Memory Programming Specs (Note 4) D110 D111 D112 D113 D114 VPP VDDP IPP IDDP TPROG Voltage on MCLR/VPP pin Supply voltage during programming Current into MCLR/VPP pin Supply current during programming Programming pulse width 12.75 4.75 – – 10 – 5.0 25 ‡ – 100 13.25 5.25 50 ‡ 30 ‡ 1000 V V mA mA µs Note 5 Terminated via internal/exter- nal interrupt or a reset * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25 °C unless otherwise stated. These parameters are for design guidance only and are not tested. ‡ These parameters are for design guidance only and are not tested, nor characterized. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC17CXX devices be driven with external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as coming out of the pin. 4: These specifications are for the programming of the on-chip program memory EPROM through the use of the table write instructions. The complete programming specifications can be found in: PIC17CXX Programming Specifications (Literature number DS30139). 5: The MCLR/VPP pin may be kept in this range at times other than programming, but is not recommended. 6: For TTL buffers, the better of the two specifications may be used. Note: When using the Table Write for internal programming, the device temperature must be less than 40˚C. |
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