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UPS540 Datasheet(PDF) 1 Page - Microsemi Corporation |
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UPS540 Datasheet(HTML) 1 Page - Microsemi Corporation |
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1 / 4 page ![]() Microsemi Watertown Division 580 Pleasant Street Watertown, MA 02472 617-926-0404, Fax: 617-924-1235 Page 1 Copyright 2000 MSC 1634.PDF 2000-12-01 UPS540 SCHOTTKY BARRIER RECTIFIER 0.5 AMP, 40 VOLT W A T E R T O W N DI V I S I ON DESCRIP T ION DESCRIP T ION DESCRIP T ION DESCRIP T ION In Microsemi’s new Powermite SMT Package, these high efficiency Schottky rectifiers offer power handling capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies. In addition to its size advantages, Powermite package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment. SURFACE MOUNT POWERMITE Surface Mount Power Package IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com KEY FEATURE S KEY FEATURE S KEY FEATURE S KEY FEATURE S !" Low Profile – Maximum height of 1.1 mm !" Footprint Area of 10 mm !" Low VF Provides Higher Efficiency !" Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink !" Supplied in 8mm Tape and Reel – 3,000 units/7” Reel; 12,000 units/13” Reel APPLICATI APPLICATI APPLICATI APPLICATIONS/BENEFITS ONS/BENEFITS ONS/BENEFITS ONS/BENEFITS !" High power Surface Mount Package !" Guard Ring Protection !" Low forward voltage !" Integral Heat Sink/Locking Tabs !" Compatible with Automatic Insertion Equipment !" Full Metallic Bottom Eliminates Flux Entrapment MECHANICAL CHARACTERISTICS MECHANICAL CHARACTERISTICS MECHANICAL CHARACTERISTICS MECHANICAL CHARACTERISTICS • Case: Molded Epoxy • Meets UL94VO at 1/8 inch • Device Marking S54 • Lead and Mounting Surface Temperature for Soldering = 260°C Maximum for 10 Seconds |
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