MSP

www.vishay.com

Vishay Sfernice

Revision: 24-Feb-14

3

Document Number: 50003

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

POWER RATING

TEMPERATURE RISE

SURFACE MOUNTING OF MSP B

Soldering cycle: 2 min at 215 °C or 10 s at 260 °C or with an

iron 40 W: 3 s at 350 °C.

Soldering is possible by wave, reflow and vapor phase.

NON INDUCTIVE WINDING FOR MSP B

Non-inductive (Ayrton Perry) winding available.

Please consult Vishay Sfernice.

PERFORMANCE

TESTS

CONDITIONS

REQUIREMENTS

Wirewound

Metal Film

Wirewound

CECC 40402-801

Metal Film

Short Time Overload

IEC 60115-1

± (0.25 % + 0.05

)

± 0.25 %

Load Life

IEC 60115-1

90’/30’ cycles

± (0.5 % + 0.05

)

± (3 % + 0.05

)

± 1 %

-

Dielectric w/s Voltage

IEC 60115-1

No flashover or breakdown

Leakage current < 10 μA

Rapid Change of

Temperature

IEC 60115-1

IEC 60068-2-14 Test Na

5 cycles (30’ at LCT/30’ at UCT)

± (0.25 % + 0.05

)

± 0.25 %

- 55 °C/+ 200 °C

- 55 °C/+ 125 °C

Climatic Sequence

IEC 60115-1

± (0.5 % + 0.05

)

± 0.5 %

- 55 °C/+ 200 °C

- 55 °C/+ 125 °C

Humidity



(Steady State)

IEC 60115-1

IEC 60068-2-3 Test Ca

95 % HR/40 °C

± (0.5 % + 0.05

)

± 1 %

56 days

10 days

Substrate Bending Test

IEC 60115-1

2 mm/10 times

± (0.25 % + 0.05

)

± 0.25 %

Shock

IEC 60115-1

IEC 60068-2-27 Test Ea

50 g’s/half sine/3 times by direction (i.e. 18 shocks)

± (0.25 % + 0.05

)n/a

Vibration

IEC 60115-1

IEC 60068-2-6 Test Fc

± (0.25 % + 0.05

)

± 0.25 %

10 Hz/2000 Hz

10 Hz/500 Hz

Resistance to



Soldering Heat

IEC 60115-1

IEC 60068-2-58 Solder bath

260 °C/10 s

± (0.5 % + 0.05

)n/a

AMBIENT TEMPERATURE IN °C

125

100

75

50

25

0

- 100

- 55

0

50

100

200

MSP B

MSP C

250

25

155

275

RATED POWER IN W

250

200

150

100

50

0

0.5

1

1.5

2

2.5

3

0

MSP

3

B

MSP

2

B

MSP

2

C