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G2003 Datasheet(PDF) 1 Page - Global Mixed-mode Technology Inc

Part # G2003
Description  120mA, Current Sinking, 10-bit I2C DAC for VCM Driver
PDF  1 Pages
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Manufacturer  GMT [Global Mixed-mode Technology Inc]
Direct Link  http://www.gmt.com.tw
Logo GMT - Global Mixed-mode Technology Inc

G2003 Datasheet(HTML) 1 Page - Global Mixed-mode Technology Inc

  G2003 Datasheet HTML 1Page - Global Mixed-mode Technology Inc  
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Ver: 0.4
Aug 12, 2012
TEL: 886-3-5788833
http://www.gmt.com.tw
1
G2003
Global Mixed-mode Technology
120mA, Current Sinking, 10-bit I2C DAC for VCM Driver
Features
120mA current sink.
2-wire (I2C-compatible) serial interface
10-bit resolution
Integrated current sense resistor
2.3V to 5.0V power supply
Power-down mode
Power-down to 0.5μA typical
Power-on reset
TDFN2X2-6 and WLCSP2X3-6 package
Applications
Auto-focus of camera modules
Shutters
Lens covers
Image stabilization
General Description
The G2003 is a single 10-bit DAC with 120mA output
current sink capability. It operates from 2.3V to 5.0V
supply.
The
DAC
is
controlled
via
2-wire
(I2C-compatible) serial interface that operates at clock
rates up to 400kHz.
The G2003 provides a power-down mode. The
power-down mode can be enabled by PD pin or I2C
interface. At power-down mode, the output current
reduces to 1μA maximum.
The G2003 is designed for autofocus, image stabiliza-
tion, and optical zoom applications in camera mod-
ules.
Ordering Information
ORDER
NUMBER
MARKING
TEMP.
RANGE
PACKAGE
(Green)
G2003RB1U
2003
0°C to +85°C
TDFN2X2-6
G2003BF1U
203
0°C to +85°C
WLCSP2X3-6
Note: RB: TDFN2X2-6
BF:WLCSP2X3-6
1: Bonding Code
U: Tape & Reel
Pin Configuration
6 Bump WLCSP
A2
A1
B2
B1
C2
C1
VCC
GND
SINK
PD
SCL
SDA
WCSP2X3-6
Top View
6 Bump WLCSP
A1
A2
B1
B2
C1
C2
SDA
SCL
PD
SINK
GND
VCC
WCSP2X3-6
Bottom View
TDFN2X2-6
1
2
3
6
5
4
Thermal
Pad
G2003
GND
VCC
SINK
PD
SCL
SDA
Note: Recommend connecting the Thermal Pad to
the Ground for excellent power dissipation.
6 Bump WLCSP
A2
A1
B2
B1
C2
C1
VCC
GND
SINK
PD
SCL
SDA
WCSP2X3-6
Top View
6 Bump WLCSP
A1
A2
B1
B2
C1
C2
SDA
SCL
PD
SINK
GND
VCC
WCSP2X3-6
Bottom View
TDFN2X2-6
1
2
3
6
5
4
Thermal
Pad
G2003
GND
VCC
SINK
PD
SCL
SDA
Note: Recommend connecting the Thermal Pad to
the Ground for excellent power dissipation.


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