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MMSF2P02ER2 Datasheet(PDF) 2 Page - ON Semiconductor

Part # MMSF2P02ER2
Description  Power MOSFET
PDF  9 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MMSF2P02ER2 Datasheet(HTML) 2 Page - ON Semiconductor

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MMSF2P02E
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2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Note 3.)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
(VGS = 0 Vdc, ID = 250 μAdc)
Temperature Coefficient (Positive)
V(BR)DSS
20
−
−
24.7
−
−
Vdc
mV/°C
Zero Gate Voltage Drain Current
(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 125°C)
IDSS
−
−
−
−
1.0
10
μAdc
Gate−Body Leakage Current (VGS = ± 20 Vdc, VDS = 0)
IGSS
−
−
100
nAdc
ON CHARACTERISTICS (Note 4.)
Gate Threshold Voltage
(VDS = VGS, ID = 250 μAdc)
Threshold Temperature Coefficient (Negative)
VGS(th)
1.0
2.0
4.7
3.0
−
Vdc
mV/°C
Static Drain−to−Source On−Resistance
(VGS = 10 Vdc, ID = 2.0 Adc)
(VGS = 4.5 Vdc, ID = 1.0 Adc)
RDS(on)
−
−
0.19
0.3
0.25
0.4
Ohm
Forward Transconductance (VDS = 3.0 Vdc, ID = 1.0 Adc)
gFS
1.0
2.8
−
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 16 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Ciss
−
340
475
pF
Output Capacitance
Coss
−
220
300
Transfer Capacitance
Crss
−
75
150
SWITCHING CHARACTERISTICS (Note 5.)
Turn−On Delay Time
(VDD = 10 Vdc, ID = 2.0 Adc,
VGS = 5.0 Vdc,
RG = 6.0 Ω)
td(on)
−
20
40
ns
Rise Time
tr
−
40
80
Turn−Off Delay Time
td(off)
−
53
106
Fall Time
tf
−
41
82
Turn−On Delay Time
(VDD = 10 Vdc, ID = 2.0 Adc,
VGS = 10 Vdc,
RG = 6.0 Ω)
td(on)
−
13
26
ns
Rise Time
tr
−
29
58
Turn−Off Delay Time
td(off)
−
30
60
Fall Time
tf
−
28
56
Gate Charge
(VDS = 16 Vdc, ID = 2.0 Adc,
VGS = 10 Vdc)
QT
−
10
15
nC
Q1
−
1.1
−
Q2
−
3.3
−
Q3
−
2.5
−
SOURCE−DRAIN DIODE CHARACTERISTICS
Forward On−Voltage (Note 4.)
(IS = 2.0 Adc, VGS = 0 Vdc)
VSD
−
1.5
2.0
Vdc
Reverse Recovery Time
(IS = 2.0 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/μs)
trr
−
34
64
ns
ta
−
18
−
tb
−
16
−
Reverse Recovery Stored Charge
QRR
−
0.035
−
μC
3. Negative sign for P−Channel device omitted for clarity.
4. Pulse Test: Pulse Width ≤ 300 μs, Duty Cycle ≤ 2%.
5. Switching characteristics are independent of operating junction temperature.



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