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MTP30P06VG Datasheet(PDF) 1 Page - ON Semiconductor

Part # MTP30P06VG
Description  P?묬hannel Power MOSFET
PDF  7 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MTP30P06VG Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 6
1
Publication Order Number:
MTP30P06V/D
MTP30P06V
Preferred Device
Power MOSFET
30 Amps, 60 Volts
P−Channel TO−220
This Power MOSFET is designed to withstand high energy in the
avalanche and commutation modes. Designed for low voltage, high
speed switching applications in power supplies, converters and power
motor controls, these devices are particularly well suited for bridge
circuits where diode speed and commutating safe operating areas are
critical and offer additional safety margin against unexpected voltage
transients.
Features
• Avalanche Energy Specified
• IDSS and VDS(on) Specified at Elevated Temperature
• Pb−Free Package is Available*
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
60
Vdc
Drain−to−Gate Voltage (RGS = 1.0 MW)
VDGR
60
Vdc
Gate−to−Source Voltage
− Continuous
− Non−repetitive (tp ≤ 10 ms)
VGS
VGSM
± 15
± 25
Vdc
Vpk
Drain Current − Continuous @ 25°C
Drain Current − Continuous @ 100°C
Drain Current − Single Pulse (tp ≤ 10 ms)
ID
ID
IDM
30
19
105
Adc
Apk
Total Power Dissipation @ 25°C
Derate above 25°C
PD
125
0.83
W
W/°C
Operating and Storage Temperature Range
TJ, Tstg −55 to 175
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc, Peak
IL = 30 Apk, L = 1.0 mH, RG = 25 W)
EAS
450
mJ
Thermal Resistance − Junction−to−Case
Thermal Resistance − Junction−to−Ambient
RqJC
RqJA
1.2
62.5
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from Case for 10 seconds
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
D
S
G
P−Channel
30 AMPERES, 60 VOLTS
RDS(on) = 80 mW
Preferred devices are recommended choices for future use
and best overall value.
Device
Package
Shipping
ORDERING INFORMATION
MTP30P06V
TO−220AB
50 Units/Rail
http://onsemi.com
MTP30P06VG
TO−220AB
(Pb−Free)
50 Units/Rail
TO−220AB
CASE 221A
STYLE 5
1
2
3
4
MARKING DIAGRAM
AND PIN ASSIGNMENT
MTP30P06V = Device Code
A
= Location Code
Y
= Year
WW
= Work Week
G
= Pb−Free Package
MTP30P06VG
AYWW
1
Gate
3
Source
4
Drain
2
Drain


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