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ST25TA02K-P Datasheet(PDF) 55 Page - STMicroelectronics |
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ST25TA02K-P Datasheet(HTML) 55 Page - STMicroelectronics |
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55 / 64 page ![]() DocID027794 Rev 2 55/64 ST25TA02K-P Maximum rating 58 9 Maximum rating Stressing the device above the rating listed in Table 56 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability. Table 56. Absolute maximum ratings Symbol Parameter Min. Max. Unit TA Ambient operating temperature -40 85 °C TSTG, hSTG, tSTG Storage conditions Sawn wafer on UV tape 15 25 °C -6 (1) 1. Counted from ST shipment date. months Kept in its original packing form TSTG Storage temperature UFDFPN5 –65 150 °C TSTG Storage temperature Sawn bumped Wafer (kept in its antistatic bag) 15 25 °C Storage time - 6 months TLEAD Lead temperature during soldering UFDFPN5 see note (2) 2. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb assembly), the ST ECOPACK® 7191395 specification, and the European directive on Restrictions on Hazardous Substances (ROHS directive 2011/65/EU, July 2011). °C VDCG GPO Power Supply -0.5 5.5 V ICC (3) 3. Based on characterization, not tested in production. Maximum absorbed power = 100 mW @ 7.5 A/m RF supply current AC0 - AC1 - 64 mA VMAX_1 (3) RF input voltage amplitude between AC0 and AC1, VSS pad left floating VAC0-VAC1 (Peak to Peak) -10 V VMAX_2 AC voltage between AC0 and VSS, or AC1 and VSS VAC0-VSS or VAC1-VSS -0.5 4.5 V VESD Electrostatic discharge voltage (human body model) (4) 4. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω) AC0-AC1 - 1500 V VESD Electrostatic discharge voltage (human body model) (4) Other pads - 3500 V |
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