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STAP08DP5XTTR Datasheet(PDF) 16 Page - STMicroelectronics |
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STAP08DP5XTTR Datasheet(HTML) 16 Page - STMicroelectronics |
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16 / 28 page ![]() Typical characteristics STAP08DP05 16/28 DocID024305 Rev 6 Figure 13. Power dissipation vs. package temperature Note: The exposed pad should be soldered to the PCB in order to derive the thermal benefits (according to Jedec 51-7). |
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