19

Aeroflex Microelectronics Solutions - HiRel

36-00-00-001

Ver. 1.5.0

3.6 DC Characteristics for LVCMOS3 Outputs (pre- and post-radiation)

Notes:

1. JTAG outputs are not tested.

2. Except open-drain output.

3. Guaranteed by design.

4. Capacitance is measured for initial qualification and when design changes might affect the input/output capacitance.

Symbol

Description

Conditions

Min

Max

Units

Low-level output voltage

(All outputs except those listed below and in

Section 3.8)

0.25

V

--

0.4

High-level output voltage

(All outputs except those listed below and in

Section 3.8)

--

V

2.4

--

Low-level output voltage

(GPIO[15:0], SPW_TXD[3:0],

SPW_TXS[3:0], TXD)

0.25

V

--

0.4

High-level output voltage

(GPIO[15:0], SPW_TXD[3:0],

SPW_TXS[3:0], TXD)

--

V

2.4

--

Low-level output voltage

(WRITE, OE, IOS, ROMS[1:0], RWE [3:0],

RAMOE [4:0], RAMS[4:0], SDCS[1:0],

SDRAS, SDCAS, SDWE, SDCLK, READ,

SDDQM[3:0], ADDR[27:0], DATA[31:0]

and CB[7:0])

0.25

V

--

0.4

High-level output voltage

(WRITE, OE, IOS, ROMS[1:0], RWE [3:0],

RAMOE [4:0], RAMS[4:0], SDCS[1:0],

SDRAS, SDCAS, SDWE, SDCLK, READ,

SDDQM[3:0], ADDR[27:0], DATA[31:0]

and CB[7:0])

--

V

2.4

--

Three-state output current

-10

10

μA

-10

10

Short-circuit output current

(All outputs except PCI outputs)

--

130

mA

-65

--

Output pin capacitance

--

16

pF