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AP8600P Datasheet(PDF) 1 Page - Advanced Power Electronics Corp. |
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AP8600P Datasheet(HTML) 1 Page - Advanced Power Electronics Corp. |
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1 / 6 page  Advanced Power N-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET ▼ Simple Drive Requirement BVDSS 80V ▼ Ultra-low On-resistance RDS(ON) 5mΩ ▼ Fast Switching Characteristic ID 3 105A ▼ RoHS Compliant & Halogen-Free Description Absolute Maximum Ratings@Tj=25 oC(unless otherwise specified) Symbol Units VDS V VGS V ID@TC=25℃ A ID@TC=25℃ A ID@TC=100℃ A IDM A PD@TC=25℃ W PD@TA=25℃ W EAS Single Pulse Avalanche Energy 4 mJ TSTG ℃ TJ ℃ Symbol Value Units Rthj-c Maximum Thermal Resistance, Junction-case 1.2 ℃ /W Rthj-a Maximum Thermal Resistance, Junction-ambient 62 ℃ /W Data and specifications subject to change without notice Parameter 1 Total Power Dissipation 2 Storage Temperature Range Operating Junction Temperature Range -55 to 150 Thermal Data 28.8 Total Power Dissipation 104 -55 to 150 Gate-Source Voltage +20 Pulsed Drain Current 1 Drain Current, VGS @ 10V Drain Current (Chip), VGS @ 10V 3 Drain Current, VGS @ 10V 3 80 Parameter Rating Drain-Source Voltage 80 AP8600P Halogen-Free Product 201602013 320 67 105 G D S G D S TO-220(P) AP4604 series are from Advanced Power innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switching performance. It provides the designer with an extreme efficient device for use in a wide range of power applications. The TO-220 package is widely preferred for all commercial- industrial through hole applications. The low thermal resistance and low package cost contribute to the worldwide popular package. G D S G D S TO-220(P) AP8600 series are from Advanced Power innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switching performance. It provides the designer with an extreme efficient device for use in a wide range of power applications. The TO-220 package is widely preferred for all commercial- industrial through hole applications. The low thermal resistance and low package cost contribute to the worldwide popular package. . |
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