M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

http://www.macom.com/support

M02016

9

CMOS Transimpedance Amplifier with AGC

for Fiber Optic Networks up to 1.25 Gbps

Rev V4

2.0 Pin/Pad Definitions

2.1

Pin/Pad Definitions

Table 2-1.

Pin/Pad Definitions

Die Pad No

Name

Function

1

AGC

Monitor or force AGC voltage

Power pin. Connect to most positive supply

3

PINK

4

PINA

Active PIN input. Connect to photo diode anode

6

MON

Analog current sink output. Current matched to average photodiode current. Intended for photo-alignment use only.

7DOUT

Differential data output (goes low as light increases)

8DOUTGND

9

GND

10

GND

11

DOUTGND

12

DOUT

Differential data output (goes high as light increases)

NA

Backside

Backside. Connect to the lowest potential, usually ground

NOTES:

1.

2.

All ground pads are common on the die. Only one ground pad needs to be connected to the TO-Can ground. However, connecting more than one ground

pad to the TO-Can ground, particularly those across the die from each other can improve performance in noisy environments.