SP3T AlGaAs PIN Diode Switch

Rev. V7

MA4AGSW3

7

7

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

7

ASSEMBLY INSTRUCTIONS

CLEANLINESS

These chips should be handled in a clean environment.

STATIC SENSITIVITY

These Devices are considered ESD Class 1A, HBM. Proper ESD techniques should be used when handling

these devices.

GENERAL HANDLING

The protective polymer coating on the active areas of the die provides scratch and impact protection,

particularly for the metal air bridge, which contacts the diode’s anode. Die should primarily be handled with

vacuum pickup tools, or alternatively with plastic tweezers.

ASSEMBLY TECHNIQUES

The MA4AGSW3, AlGaAs device is designed to be mounted with electrically conductive silver epoxy or with a

low temperature solder perform, which does not have a rich tin content.

SOLDER DIE ATTACH

Only solders which do not scavenge gold, such as 80/20, Au/Sn or Indalloy #2 is recommended. Do not

expose die to temperatures greater than 300°C for more than 10 seconds.

ELECTRICAL CONDUCTIVE EPOXY DIE ATTACH

Use a controlled thickness of approximately 2 mils for best electrical conductivity and lowest thermal

resistance. Cure epoxy per manufacturer

RIBBON/WIRE BONDING

Thermo-compression wedge or ball bonding may be used to attach ribbons or wire to the gold bonding pads.

A 1/4 x 3 mil gold ribbon is recommended on all RF ports and should be kept as short as possible for the

lowest inductance and best microwave performance. For more detailed handling and assembly instructions,

see Application Note M541, “Bonding and Handling Procedures for Chip Diode Devices” at

www.macomtech.com.

Ordering Information

Part Number

Package

MA4AGSW3

Waffle Pack