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MB9B500B Datasheet(PDF) 49 Page - SPANSION |
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MB9B500B Datasheet(HTML) 49 Page - SPANSION |
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49 / 113 page ![]() D a t a S h e e t 46 MB9B500B-DS706-00021-3v0-E, December 15, 2014 CONFIDENTIAL Store products in locations where temperature changes are slight. (2) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C and 30°C. When you open Dry Package that recommends humidity 40% to 70% relative humidity. (3) When necessary, Spansion packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage. (4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust. ・ Baking Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Spansion recommended conditions for baking. Condition: 125°C/24 h ・ Static Electricity Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions: (1) Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be needed to remove electricity. (2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment. (3) Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1 MΩ). Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is recommended. (4) Ground all fixtures and instruments, or protect with anti-static measures. (5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies. |
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