ADAV4601

Rev. B | Page 58 of 60

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MS-026-BEC

1.45

1.40

1.35

0.15

0.05

0.20

0.09

0.10

COPLANARITY

VIEW A

ROTATED 90° CCW

SEATING

PLANE

7°

3.5°

0°

61

60

1

80

20

41

21

40

VIEW A

1.60

MAX

0.75

0.60

0.45

16.20

16.00 SQ

15.80

14.20

14.00 SQ

13.80

0.65

BSC

LEAD PITCH

0.38

0.32

0.22

TOP VIEW

(PINS DOWN)

PIN 1

Figure 49. 80-Lead Low Profile Quad Flat Package [LQFP]

(ST-80-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADAV4601BSTZ1

–40°C to +85°C

80-Lead Low Profile Quad Flat Package [LQFP]

ST-80-2

EVAL-ADAV4601EBZ1

Evaluation Board

coating on the leads of each device is 100% pure Sn electroplate. The device is suitable for Pb-free applications and can withstand surface-mount soldering at up to

255°C (±5°C). In addition, it is backward compatible with conventional SnPb soldering processes. This means the electroplated Sn coating can be soldered with Sn/Pb

solder pastes at conventional reflow temperatures of 220°C to 235°C.