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CC2510F8RHHT Datasheet(PDF) 33 Page - Texas Instruments

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Part # CC2510F8RHHT
Description  Low-Power SoC (System-on-Chip)
PDF  245 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CC2510F8RHHT Datasheet(HTML) 33 Page - Texas Instruments

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CC2510Fx / CC2511Fx
SWRS055G
Page 33 of 236
8.2
Radio
CC2510Fx/CC2511Fx features an RF transceiver
based
on
the
industry-leading
CC2500,
requiring very few external components. See
Section 13 for details.
9
Application Circuit
Only a few external components are required
for
using
the
CC2510Fx/CC2511Fx. The
recommended application circuit for
CC2510Fx
is shown in Figure 10. The recommended
application circuits for
CC2511Fx are shown in
Figure 11 and Figure 12. The first of the
recommended
CC2511Fx circuit uses a
fundamental crystal and the second uses a 3
rd
overtone crystal. The external components are
described in Table 28, and typical values are
given in Table 29.
9.1
Bias Resistor
The bias resistor R271 is used to set an
accurate bias current.
9.2
Balun and RF Matching
The
balanced
RF
input
and
output
of
CC2510Fx/CC2511Fx share two common pins and
are designed for a simple, low-cost matching
and balun network on the printed circuit board.
The
RX-
and
TX
switching
at
the
CC2510Fx/CC2511Fx front-end are controlled by a
dedicated on-chip function, eliminating the
need for an external RX/TX-switch.
A few passive external components combined
with the internal RX/TX switch/termination
circuitry ensures match in both RX and TX
mode.
Although
CC2510Fx/CC2511Fx has a balanced
RF input/output, the chip can be connected to
a single-ended antenna with few external low
cost capacitors and inductors.
The
passive
matching/filtering
network
connected to
CC2510Fx/CC2511Fx should have
the following differential impedance as seen
from the RF-port (RF_P and RF_N) towards
the antenna:
Zout
= 80 + j74 Ω
C232, C242, and two inductive transmission
PCB lines form the recommended balun that
converts the differential RF port on
CC2510Fx to
a single-ended RF signal. For the
CC2511Fx
balun, the inductive PCB lines are replaced by
L241 and L231. Note that either of the
solutions (PCB lines or discrete components)
can be used for both the chips. C241 and
C231 are needed for DC blocking. Together
with an appropriate LC filter network, the balun
components also transform the impedance to
match a 50
Ω antenna (or cable). Component
values for the RF balun and LC network are
found
in
the
latest
CC2510EM
and
CC2511Dongle reference designs ([1] and [2]).
Suggested values are also listed in Table 29.
The balun and LC filter component values,
their placement and layout are important in
order
to
keep
the
performance
of
the
CC2510Fx/CC2511Fx optimized. It is highly
recommended to follow the CC2510EM /
CC2511Dongle
reference
designs.
Gerber
files and schematics for the reference designs
are available for download from the TI website
9.3
Crystal
The crystal oscillator for the
CC2510Fx uses an
external crystal X1, with two loading capacitors
(C201 and C211) (see Figure 10 and Table
28).
The
CC2511Fx should use a 48 MHz
fundamental (X3) or a 48 MHz 3
rd overtone low
cost external crystal (X4). Depending on the
option selected, different loading capacitors
(C203 and C214 or C202, C212, and C213)
must be used. When X4 is used, an inductor
(L281) must also be connected in series with
C212 (see Figure 11, Figure 12 and Table 28).
The recommended application circuits also
show the connections for an optional 32.768
kHz crystal oscillator with external crystal X2
Note: The high speed crystal oscillator
must
be
stable
(SLEEP.XOSC_STB=1)
before using the radio.
CC2511F8 - Not Recommended for New Designs



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