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AM26C32MFKB Datasheet(PDF) 12 Page - Texas Instruments |
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AM26C32MFKB Datasheet(HTML) 12 Page - Texas Instruments |
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12 / 30 page ![]() AM26C32 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 1B 1A 1Y G 2Y 2A 2B GND VCC 4B 4A 4Y G 3Y 3A 3B 0.1µF VDD Termination Resistor Reduce logic signal trace when possible AM26C32 SLLS104K – DECEMBER 1990 – REVISED JUNE 2015 www.ti.com 10 Power Supply Recommendations Place 0.1- μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high impedance power supplies. 11 Layout 11.1 Layout Guidelines For best operational performance of the device, use good PCB layout practices, including: • Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low impedance power sources local to the analog circuitry. – Connect low-ESR, 0.1- μF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single supply applications. • Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital and analog grounds, paying attention to the flow of the ground current. • To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed to in parallel with the noisy trace. • Place the external components as close to the device as possible. Keeping RF and RG close to the inverting input minimizes parasitic capacitance. • Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit. • Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials. 11.2 Layout Example Figure 6. Trace Layout on PCB and Recommendations 12 Submit Documentation Feedback Copyright © 1990–2015, Texas Instruments Incorporated Product Folder Links: AM26C32 |
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