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CDCM1802 Datasheet(PDF) 4 Page - Texas Instruments

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Part # CDCM1802
Description  CDCM1802 Clock Buffer With Programmable Divider, LVPECL I/O Additional LVCMOS Output
PDF  30 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CDCM1802 Datasheet(HTML) 4 Page - Texas Instruments

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CDCM1802
SCAS759B – APRIL 2004 – REVISED NOVEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VDD
Supply voltage
−0.3
3.8
V
VI
Input voltage
−0.2
(VDD + 0.2)
V
VO
Output voltage
−0.2
(VDD + 0.2)
V
Yn, Yn, IOSD
Differential short circuit current
Continuous
TJ
Maximum junction temperature
125
125
°C
Tstg
Storage temperature
−65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±3000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±1500
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VDD
Supply voltage
3
3.3
3.6
V
VDD
Supply voltage (only functionality)
2.375
3.6
V
TA
Operating free-air temperature
–40
85
°C
6.4 Thermal Information
CDCM1802
THERMAL METRIC(1)
RGT (VQFN)
UNIT
16 PINS
RθJA
Junction-to-ambient thermal resistance
48.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
66.9
°C/W
RθJB
Junction-to-board thermal resistance
22.5
°C/W
ψJT
Junction-to-top characterization parameter
1.7
°C/W
ψJB
Junction-to-board characterization parameter
22.5
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
5.8
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2004–2015, Texas Instruments Incorporated
Product Folder Links: CDCM1802



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