SN74AHCT240PWLE datasheet(5/28 Pages) TI1

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SN54AHCT240, SN74AHCT240

www.ti.com

SCLS252M – OCTOBER 1995 – REVISED APRIL 2016

Product Folder Links: SN54AHCT240 SN74AHCT240

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(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

7.4 Thermal Information

THERMAL METRIC(1)

SN74AHCT240

UNIT

DGV

20 PINS

RθJA

Junction-to-ambient thermal

resistance

83.0

99.9

119.2

54.9

80.4

105.4

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

48.9

61.7

34.5

41.7

46.9

39.5

RθJB

Junction-to-board thermal

resistance

50.5

55.2

60.7

35.8

47.9

56.4

ψJT

Junction-to-top

characterization parameter

21.1

22.6

1.2

27.9

19.9

3.1

ψJB

Junction-to-board

characterization parameter

50.1

54.8

60.0

35.7

47.5

55.8

(1)

On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.

(2)

This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.

7.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

TA = 25°C

SN54AHCT240

–40°C to 85°C

SN74AHCT240

–40°C to 125°C

SN74AHCT240

UNIT

MIN

TYP

MAX

MIN

MAX

MIN

MAX

MIN

MAX

VOH

IOH = –50 µA

4.5 V

4.4

4.5

4.4

IOH = –8 mA

3.94

3.8

VOL

IOL = 50 µA

4.5 V

0.1

IOL = 8 mA

0.36

0.44

IOZ

VO = VCC or GND

5.5 V

±0.25

±2.5

µA

VI = 5.5 V or GND

0 V to

5.5 V

±0.1

±1(1)

±1

µA

ICC

VI = VCC or GND, IO = 0

5.5 V

µA

ΔICC

(2)

One input at 3.4 V,

Other inputs at VCC or

GND

5.5 V

1.35

1.5

VI = VCC or GND

5 V

2.5

VO = VCC or GND

5 V

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