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TLK2501IRCPR Datasheet(PDF) 18 Page - Texas Instruments |
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TLK2501IRCPR Datasheet(HTML) 18 Page - Texas Instruments |
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18 / 25 page  TLK2501 1.5 TO 2.5 GBPS TRANSCEIVER SLLS427D − AUGUST 2000 − REVISED JULY 2003 18 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 thermal characteristics PARAMETER TEST CONDITION MIN TYP MAX UNIT Board-mounted, no air flow, high conductivity TI recommended test board, chip soldered or greased to thermal land 21.47 RθJA Junction-to-free-air thermal resistance Board-mounted, no air flow, high conductivity TI recommended test board with thermal land but no solder or grease thermal connection to thermal land 42.20 °C/W Board-mounted, no air flow, JEDEC test board 75.83 Board-mounted, no air flow, high conductivity TI recommended test board, chip soldered or greased to thermal land 0.38 RθJC Junction-to-case thermal resistance Board-mounted, no air flow, high conductivity TI recommended test board with thermal land but no solder or grease thermal connection to thermal land 0.38 °C/W Board-mounted, no air flow, JEDEC test board 7.8 |
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