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EXAMPLE BOARD LAYOUT

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

20X (0.2)

20X (0.6)

(

) TYP

VIA

0.2

16X (0.4)

(3.1)

(2.3)

(0.7)

(1.14)

(R

)

TYP

0.05

(1.9)

X1QFN - 0.5 mm max height

RWP0020A

PLASTIC QUAD FLATPACK - NO LEAD

4221912/A 03/2015

SYMM

1

6

7

10

11

16

17

20

SYMM

LAND PATTERN EXAMPLE

SCALE:20X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)