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MPX5100DP Datasheet(PDF) 7 Page - Motorola, Inc

Part # MPX5100DP
Description  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  12 Pages
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Manufacturer  MOTOROLA [Motorola, Inc]
Direct Link  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPX5100DP Datasheet(HTML) 7 Page - Motorola, Inc

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MPX5100/MPXV5100 SERIES
MOTOROLA
Motorola Sensor Device Data
7
PACKAGE DIMENSIONS
PIN 1
F
G
N
L
R
12
34
5
6
6 PL
D
SEATING
PLANE
-T-
M
A
M
0.136 (0.005)
T
POSITIVE PRESSURE
(P1)
C
B
M
J
S
-A-
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
MAX
MILLIMETERS
INCHES
16.00
13.56
5.59
0.84
1.63
0.100 BSC
2.54 BSC
0.40
18.42
30˚ NOM
30˚ NOM
12.57
11.43
DIM
A
B
C
D
F
G
J
L
M
N
R
S
MIN
0.595
0.514
0.200
0.027
0.048
0.014
0.695
0.475
0.430
0.090
MAX
0.630
0.534
0.220
0.033
0.064
0.016
0.725
0.495
0.450
0.105
MIN
15.11
13.06
5.08
0.68
1.22
0.36
17.65
12.07
10.92
2.29
2.66
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
CASE 867-08
ISSUE N
BASIC ELEMENT
DATE 09/20/99
CASE 867B-04
ISSUE F
SEATING PLANE
R
N
C
J
PIN 1
M
Q
M
0.25
T
B
6X
D
G
F
S
K
V
S
P
M
0.173
Q S
T
L
U
A
1
2
34
5
6
T
P
P
Q
Q
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
MILLIMETERS
2.54 BSC
23.11 BSC
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
MIN
29.08
17.4
7.75
0.68
1.22
0.36
17.65
7.37
10.67
3.89
3.89
5.84
5.59
4.62
MAX
29.85
18.16
8.26
0.84
1.63
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.1
4.93
NOTES:
1.
2.
DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
CASE 867B-04
ISSUE F
PRESSURE SIDE PORTED (AP, GP)
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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