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W232
4
Absolute Maximum Ratings
Stresses greater than those listed in this table may cause per-
manent damage to the device. These represent a stress rating
only. Operation of the device at these or any other conditions
above those specified in the operating sections of this specifi-
cation is not implied. Maximum conditions for extended peri-
ods may affect reliability.
.
Parameter
Description
Rating
Unit
VDD, VIN
Voltage on any Pin with Respect to GND
–0.5 to +7.0
V
TSTG
Storage Temperature
–65 to +150
°C
TA
Operating Temperature
0 to +70
°C
TB
Ambient Temperature under Bias
–55 to +125
°C
PD
Power Dissipation
0.5
W
DC Electrical Characteristics: TA =0°C to 70°C, VDD = 3.3V ±10%
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
IDD
Supply Current
Unloaded, 100 MHz
200
mA
VIL
Input Low Voltage
0.8
V
VIH
Input High Voltage
2.0
V
VOL
Output Low Voltage
IOL = 12 mA
0.8
V
VOH
Output High Voltage
IOH = –12 mA
2.1
V
IIL
Input Low Current
VIN = 0V
50
µA
IIH
Input High Current
VIN = VDD
50
µA
AC Electrical Characteristics: TA = 0°C to +70°C, VDD = 3.3V ±10%
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
fOUT
Output Frequency
30-pF load[4]
25
140
MHz
tR
Output Rise Time
0.8V to 2.0V, 30-pF load
2.1
ns
tF
Output Fall Time
2.0V to 0.8V, 30-pF load
2.5
ns
tICLKR
Input Clock Rise Time[1]
4.5
ns
tICLKF
Input Clock Fall Time[1]
4.5
ns
tPEJ
CLK to FBIN Skew Variation[2, 3]
Measured at VDD/2
–350
0
350
ps
tSK
Output to Output Skew
All outputs loaded equally
–100
0
100
ps
tD
Duty Cycle
30-pF load
43
50
58
%
tLOCK
PLL Lock Time
Power supply stable
1.0
ms
tJC
Jitter, Cycle-to-Cycle[5]
150
ps
Notes:
1.
Longer input rise and fall time will degrade skew and jitter performance.
2.
Skew is measured at VDD/2 on rising edges.
3.
Duty cycle is measured at VDD/2.
4.
Production tests are run at 133 MHz.
5.
For frequencies below 40 MHz, Cycle-to-Cycle Jitter degrades to 175 ps.
Ordering Information
Ordering
Code
Option Number
Package Type
W232
-09, -10
24-pin TSSOP
Document #: 38-00827-C
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