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THS7002IPWPRG4 Datasheet(PDF) 30 Page - Texas Instruments |
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THS7002IPWPRG4 Datasheet(HTML) 30 Page - Texas Instruments |
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30 / 41 page ![]() THS7001, THS7002 70MHz PROGRAMMABLEGAIN AMPLIFIERS SLOS214C − OCTOBER 1998 − REVISED MARCH 2007 30 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 APPLICATION INFORMATION general PowerPAD design considerations (continued)123456 The actual thermal performance achieved with the THS7001PWP/THS7002PWP in its PowerPAD package depends on the application. In the example above, if the size of the internal ground plane is approximately 3 inches × 3 inches (76,2 mm x 76.2 mm), then the expected thermal coefficient, θJA, is about 32.6°C/W for the THS7001 and 27.9 _C/W for the THS7002. For a given θJA, the maximum power dissipation is shown in Figure 69 and is calculated by the following formula: P D + T MAX –T A q JA Where: PD = Maximum power dissipation of THS7001 and THS7002 IC (watts) TMAX = Absolute maximum junction temperature (150°C) TA = Free-ambient air temperature ( °C) θJA = θJC + θCA θJC = Thermal coefficient from junction to case (THS7001 = 1.4°C/W; THS7002 = 0.72°C/W) θCA = Thermal coefficient from case to ambient air (°C/W) THS7002 MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 7 6 5 4 3 2 −40 −20 0 20 40 60 TA − Free-Air Temperature − _C 1 80 100 8 TJ = 150 _C 0 θJA = 27.9 _C/W 2 oz. Trace and Copper Pad With Solder θJA = 56.2 _C/W 2 oz. Trace and Copper Pad Without Solder THS7001 MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 7 6 5 4 3 2 −40 −20 0 20 40 60 TA − Free-Air Temperature − _C 1 80 100 8 TJ = 150 _C 0 θJA = 32.6 _C/W 2 oz. Trace and Copper Pad With Solder θJA = 74.4 _C/W 2 oz. Trace and Copper Pad Without Solder NOTE A: Results are with no air flow and PCB size = 3” × 3” (76,2 mm x 76,2 mm) Figure 69. Maximum Power Dissipation vs Free-Air Temperature More complete details of the PowerPAD installation process and thermal management techniques can be found in the Texas Instruments technical brief, PowerPAD Thermally Enhanced Package. This document can be found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be ordered through your local TI sales office. Refer to literature number SLMA002 when ordering. evaluation board An evaluation board is available both the THS7001 (literature number SLOP250) and for the THS7002 (literature number SLOP136). These boards has been configured for very low parasitic capacitance in order to realize the full performance of the amplifiers. These EVM’s incorporate DIP switches to demonstrate the full capabilities of the THS7001 and THS7002 independent of any digital control circuitry. For more information, please refer to the THS7001 EVM User’s Guide (literature number SLOU057)and the THS7002 EVM User’s Guide (literature number SLOU037). To order a evaluation board contact your local TI sales office or distributor. |
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