LMV862MMXSLASHNOPB datasheet(2/30 Pages) TI1

2 / 30 page

LMV861, LMV862

SNOSAZ5C – FEBRUARY 2008 – REVISED MARCH 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Human Body Model

2 kV

ESD Tolerance(3)

Charge-Device Model

1 kV

Machine Model

200V

VIN Differential

± Supply Voltage

Supply Voltage (VS = V

+ – V−)

Voltage at Input/Output Pins

V+ +0.4V

V−

−0.4V

Storage Temperature Range

−65°C to +150°C

Junction Temperature(4)

+150°C

Soldering Information

Infrared or Convection (20 sec)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.

Operating Ratings

(1)

Temperature Range(2)

−40°C to +125°C

Supply Voltage (VS = V

+ – V−)

2.7V to 5.5V

Package Thermal Resistance (

θJA

(2))

5-Pin SC70

302°C/W

8-Pin VSSOP

217°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.

3.3V Electrical Characteristics

(1)

Unless otherwise specified, all limits are guaranteed for TA = 25°C, V

+ = 3.3V, V− = 0V, V

CM = V

+/2, and R

L =10 kΩ to V

+/2.

Boldface limits apply at the temperature extremes.

Symbol

Parameter

Conditions

Min(2)

Typ(3)

Max(2)

Units

VOS

Input Offset Voltage(4)

±273

±1000

μV

1260

TCVOS

Input Offset Voltage Temperature

±0.7

±2.6

μV/°C

Drift(4)(5)

Input Bias Current(5)

0.1

500

IOS

Input Offset Current

(1)

Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very

limited self-heating of the device such that TJ = TA. No assurance of parametric performance is indicated in the electrical tables under

conditions of internal self-heating where TJ > TA.

(2)

Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using

statistical quality control (SQC) method.

(3)

Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped

production material.

(4)

The typical value is calculated by applying absolute value transform to the distribution, then taking the statistical average of the resulting

distribution

(5)

This parameter is specified by design and/or characterization and is not tested in production.

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