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LP5900TL-2.2/NOPB Datasheet(PDF) 3 Page - Texas Instruments

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Part # LP5900TL-2.2/NOPB
Description  LP5900 150-mA Ultra-Low-Noise LDO for RF and Analog Circuits - Requires No Bypass Capacitor
PDF  30 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LP5900TL-2.2/NOPB Datasheet(HTML) 3 Page - Texas Instruments

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1 OUT
2 N/C
3 GND
IN 6
N/C 5
Bottom View
Thermal
Pad
OUT 1
N/C 2
GND 3
6 IN
5 N/C
Top View
4 EN
EN 4
Thermal
Pad
IN
A2
OUT
B2
IN
A2
OUT
B2
A1
EN
B1
GND
A1
EN
B1
GND
Top View
Bottom View
3
LP5900
www.ti.com
SNVS358R – JULY 2005 – REVISED JUNE 2016
Product Folder Links: LP5900
Submit Documentation Feedback
Copyright © 2005–2016, Texas Instruments Incorporated
5 Pin Configuration and Functions
YZR and YPF Packages
4-Pin DSBGA
NGF Package
6-Pin WSON with Exposed Thermal Pad
Pin Functions
PIN
TYPE
DESCRIPTION
DSBGA
WSON
NAME
A1
4
EN
I
Enable input; disables the regulator when
≤ 0.4 V. Enables the regulator when ≥
1.2 V. An internal 1-M
Ω pull-down resistor connects this input to ground.
A2
6
IN
I
Input voltage supply. Connect a 0.47-µF capacitor at this input.
B1
3
GND
—
Common ground
B2
1
OUT
O
Output voltage. A 0.47-
μF Low ESR capacitor should be connected to this pin.
Connect this output to the load circuit.
—
2
NC
—
No internal connection.
—
Thermal
Pad
Thermal Pad
—
The exposed thermal pad on the bottom of the packagemust be connected to a
copper area on the PCB under the package. TI recommends use of thermal vias
to remove heat from the package into the PCB. Connect the thermal pad to
ground potential or leave floating. Do not connect the thermal pad to any potential
other than the same ground potential seen at device pin 3. For additional
information on using TI's non-pullback WSON package, see AN-1187 Leadless
Leadframe Package (LLP) (SNOA401).



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