LP5900TL-2.2SLASHNOPB datasheet(4/30 Pages) TI1

4 / 30 page

LP5900

SNVS358R – JULY 2005 – REVISED JUNE 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Input voltage, VIN

–0.3

Output voltage, VOUT

–0.3

VIN + 0.3

Enable input voltage, VEN

–0.3

VIN + 0.3

Continuous power dissipation(4)

Internally Limited

Junction temperature, TJMAX

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

(1)

All voltages are with respect to the potential at the GND pin.

(2)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See Application and

Implementation.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage, VIN

2.5

5.5

Enable voltage, VEN

VIN + 0.3

Output current, IOUT

(2)

150

Junction temperature, TJ

–40

125

°C

Ambient temperature, TA

(2)

–40

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LP5900

UNIT

NGF

YZR/YPF

6 PINS

4 PINS

RθJA

Junction-to-ambient thermal resistance

79.8

177.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

84.4

0.7

°C/W

RθJB

Junction-to-board thermal resistance

20.4

35.6

°C/W

ψJT

Junction-to-top characterization parameter

2.6

5.8

°C/W

ψJB

Junction-to-board characterization parameter

20.3

35.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

11.2

—

°C/W

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