3

TLV521

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SNOSD26 – MAY 2016

Product Folder Links: TLV521

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

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over operating free-air temperature range (unless otherwise noted)

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MIN

MAX

UNIT

−0.3

6

V

IN+, IN–, OUT Pins

V

40

mA

–300

300

mV

Junction Temperature

–40

150

°C

Mounting Temperature

Infrared or Convection (30 sec.)

260

°C

Wave Soldering Lead Temp. (4 sec.)

260

°C

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

Machine Model

±200

(1)

Absolute Maximum Ratings indicate limits beyond which damage may occur. Recommended Operating Conditions indicate conditions

for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and test conditions,

see Electrical Characteristics.

6.3 Recommended Operating Conditions

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Temperature Range

−40

125

°C

1.7

5.5

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

TLV521

UNIT

DCK (SC70)

5 PINS

Junction-to-ambient thermal resistance

269.9

°C/W

Junction-to-case (top) thermal resistance

93.7

°C/W

Junction-to-board thermal resistance

48.8

°C/W

Junction-to-top characterization parameter

2

°C/W

Junction-to-board characterization parameter

47.9

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W