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HV7360 Datasheet(PDF) 13 Page - Microchip Technology |
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HV7360 Datasheet(HTML) 13 Page - Microchip Technology |
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13 / 18 page ![]() RECOMMENDED LAND PATTERN Dimension Limits Units C2 Contact Pad Spacing Contact Pitch MILLIMETERS 0.50 BSC MIN E MAX 6.50 Contact Pad Diameter (X22) X 0.25 Microchip Technology Drawing C04-2414A NOM 22-Ball Chip Array Ball Grid Array (JY) - 5x7 mm Body [CABGA] SILK SCREEN C1 Contact Pad Spacing 4.00 Contact Pad to Contact Pad G 0.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M 1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: C2 C1 E E ØX G G 2016 Microchip Technology Inc. DS20005570A-page 13 HV7360/HV7361 |
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