 2015-2016 Microchip Technology Inc.

DS20005391B-page 13

HV2601 / HV2701

Note:

For more information about ball coordinates, contact Microchip sales.

42-Ball Bumped Die Package Outline (BD)

5.29x5.30mm body, 1.0 mm height (max), 0.52 / 0.60mm pitch

Symbol

A

A1

A2

b

D

D1

E

E1

E2

e

e1

Dimension

(mm)

MIN

0.9

0.21

0.

0.29

5.19

4.20

BSC

5.20

4.04

BSC

0.68

BSC

0.60

BSC

0.52

BSC

NOM

0.9 5

0.24

0.7

0.32

5.29

5.30

MAX

1.0

0.27

0.7

0.35

5.39

5.40

Top View

View B

Side View

A2

A1

Seating

Plane

View A

View B

Bottom View

D

View A

b

E

A

Note 1

(Ball 1

Index Area

D/4 x E/4)

0,0

E1

e1

E2

e

D1

e

e1

e1

e

C/L

C/L

1

42

1

42

Notes:

1.

printed indicator.