www.ti.com

PACKAGE OUTLINE

C

TYP

-.244

.228

-6.19

5.80

[

]

.069 MAX

[1.75]

14X .0250

[0.635]

16X

-.012

.008

-0.30

0.21

[

]

2X

.175

[4.45]

TYP

-.010

.005

-0.25

0.13

[

]

0 - 8

-.010

.004

-0.25

0.11

[

]

(.041 )

[1.04]

.010

[0.25]

GAGE PLANE

-.035

.016

-0.88

0.41

[

]

A

NOTE 3

-.197

.189

-5.00

4.81

[

]

B

NOTE 4

-.157

.150

-3.98

3.81

[

]

SHRINK SMALL-OUTLINE PACKAGE

SSOP - 1.75 mm max height

DBQ0016A

4214846/A 03/2014

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.

Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed .006 inch, per side.

4. This dimension does not include interlead flash.

5. Reference JEDEC registration MO-137, variation AB.

1

16

.007 [0.17]

C A

B

9

8

PIN 1 ID AREA

SEATING PLANE

.004 [0.1] C

SEE DETAIL A

TYPICAL

DETAIL A

SCALE 2.800

31

ISO7740, ISO7741, ISO7742

www.ti.com

SLLSEP4A – MARCH 2016 – REVISED JUNE 2016

Product Folder Links: ISO7740 ISO7741 ISO7742

Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated