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PACKAGE OUTLINE

C

TYP

10.63

9.97

2.65 MAX

14X 1.27

16X

0.51

0.31

2X

8.89

TYP

0.38

0.25

0 - 8

0.3

0.1

(1.4)

0.25

GAGE PLANE

1.27

0.40

A

NOTE 3

10.5

10.1

B

NOTE 4

7.6

7.4

4221009/A 08/2013

SOIC - 2.65 mm max height

DW0016B

SOIC

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm, per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.

5. Reference JEDEC registration MO-013, variation AA.

1

16

0.25

C A

B

9

8

PIN 1 ID

AREA

SEATING PLANE

0.1 C

SEE DETAIL A

TYPICAL

DETAIL A

SCALE 1.500

34

ISO7740, ISO7741, ISO7742

SLLSEP4A – MARCH 2016 – REVISED JUNE 2016

www.ti.com

Product Folder Links: ISO7740 ISO7741 ISO7742

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