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TPS22918

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SLVSD76B – FEBRUARY 2016 – REVISED JUNE 2016

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9.2.3 Application Curves

CT = 0 µF

Figure 30. TPS22918 Inrush Current

CT = 220 µF

Figure 31. TPS22918 Inrush Current

10 Power Supply Recommendations

placed as close to the device terminal as possible with the recommended 1-µF bypass capacitor. If the supply is

located more than a few inches from the device terminals, additional bulk capacitance may be required in

addition to the ceramic bypass capacitors. If additional bulk capacitance is required, an electrolytic, tantalum, or

ceramic capacitor of 1 µF may be sufficient.

The TPS22918 operates regardless of power sequencing order. The order in which voltages are applied to VIN

and ON will not damage the device as long as the voltages do not exceed the absolute maximum operating

conditions. If voltage is applied to ON before VIN, the slew rate of VOUT will not be controlled.

11 Layout

11.1 Layout Guidelines

VIN and VOUT traces should be as short and wide as possible to accommodate for high current.

The VIN pin should be bypassed to ground with low ESR ceramic bypass capacitors. The typical recommended

bypass capacitance is 1-µF ceramic with X5R or X7R dielectric. This capacitor must be placed as close to the

device pins as possible.