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TS3USB32008RSVR Datasheet(PDF) 13 Page - Texas Instruments

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Part # TS3USB32008RSVR
Description  USB 2.0 Applications
PDF  23 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TS3USB32008RSVR Datasheet(HTML) 13 Page - Texas Instruments

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background image
D+
D-
MicroUSB
Connector
D+
D-
ID_COM
GND
VBUS
USB_DM
DP
DM
ID
USB+
USB-
ID_USB
VBUS
MHL+
MHL-
ID_MHL
MHL+/MyDP+
MHL-/MyDP-
CBUS/ID
HDMI
USB_DP
UART_TX
UART_RX
SDA
SCL
INT
VBAT
Baseband or
Application
Processor
TSU6111A
HDMI to
MHL/MyDP Bridge
TS3USB3200
VBAT
To
Battery
Charger
SEL1
SEL2
VBUS
ID
GND
PSEL
VCC
Copyright © 2016, Texas Instruments Incorporated
13
TS3USB3200
www.ti.com
SCDS333B – JUNE 2012 – REVISED JULY 2016
Product Folder Links: TS3USB3200
Submit Documentation Feedback
Copyright © 2012–2016, Texas Instruments Incorporated
Typical Applications (continued)
Figure 17. Eye Pattern: 3-Gbps MHL Eye Pattern for With
No Device
Figure 18. Eye Pattern: 3-Gbps MHL Eye Pattern for MHL
Switch
8.2.2 TS3USB3200 Powered by Mobile Device’s Standalone Battery
The TS3USB3200 can also be powered by the mobile device’s standalone battery. Figure 19 shows a typical
implementation. The VBUS pin of the TS3USB3200 can simply be grounded under such conditions.
Figure 19. Typical Application Schematic Powered by Mobile Devices
8.2.2.1 Design Requirements
The TS3USB3200 can be properly operated without any external components. However, TI recommends that
unused pins must be connected to ground through a 50-Ω resistor to prevent signal reflections back into the
device.
8.2.2.2 Detailed Design Procedure
The VBUS pin of the TS3USB3200 can simply be grounded under such conditions.
9 Power Supply Recommendations
Power to the device is supplied through the VCC pin and must follow the USB 1.0, 1.1, and 2.0 standards. TI
recommends placing a bypass capacitor as close to the supply pin VCC as possible to help smooth out lower
frequency noise to provide better load regulation across the frequency spectrum.



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