TSB81BA3IPFPEP datasheet(55/61 Pages) TI1

55 / 61 page

TSB81BA3D, TSB81BA3DI

IEEE 1394b THREE-PORT CABLE TRANSCEIVER/ARBITER

SLLS559E − DECEMBER 2002 − REVISED JUNE 2006

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

THERMAL PAD MECHANICAL DATA

This PowerPAD

™ package incorporates an exposed thermal pad that is designed to be attached directly to an

external heatsink. When the thermal pad is soldered directly to the printed circuit board (PCB), the PCB can

be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly

to a ground plane or special heatsink structure designed into the PCB. This design optimizes the heat transfer

from the integrated circuit (IC).

For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities,

refer to the Technical Brief, PowerPAD Thermally Enhanced Package, TI literature number SLMA002 and the

Application Brief, PowerPAD Made Easy, TI literature number SLMA004. Both documents are available at

www.ti.com.

The exposed thermal pad dimensions for this package are shown in the following illustration.

TSB81BA3IPFPEP Datasheet(PDF) 55 Page - Texas Instruments