MCP9902 datasheet(44/50 Pages) MICROCHIP

44 / 50 page

MCP9902/3/4

DS20005382C-page 44

 2015-2016 Microchip Technology Inc.

RECOMMENDED LAND PATTERN

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-2206A

10-Lead Very Thin Plastic Dual Flat, No Lead Package (9Q) - 3x3 mm Body [VDFN]

SILK SCREEN

(G2)

Dimension Limits

Units

Optional Center Pad Width

Center Pad Chamfer

Optional Center Pad Length

Contact Pitch

2.40

1.70

MILLIMETERS

0.50 BSC

MIN

MAX

0.28

Contact Pad Length (X10)

Contact Pad Width (X10)

0.80

0.30

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

NOM

Contact Pad Spacing

3.00

Contact Pad to Contact Pad (X8)

0.20

Contact Pad to Center Pad (X10)

0.25 REF

REF: Reference Dimension, usually without tolerances, for reference only.

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

2X CH

ØV

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

Dimensioning and tolerancing per ASME Y14.5M

MCP9902 Datasheet(PDF) 44 Page - Microchip Technology

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