©2014 Silicon Storage Technology, Inc.

DS-70005004G

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2.4 GHz High-Efficiency, High-Gain Power Amplifier Module

SST12LP17E

Data Sheet

Microchip Technology Drawing C04-201-XX8E-A Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Number of Terminals

Overall Height

Terminal Width

Overall Width

Overall Length

Terminal Length

Exposed Pad Width

Exposed Pad Length

Pitch

Standoff

Units

Dimension Limits

A1

A

b

D

E2

D2

e

L

E

N

0.40 BSC

0.70

1.55

0.25

0.15

0.34

0.00

0.20

2.00 BSC

0.30

1.60

0.75

0.37

0.02

2.00 BSC

MILLIMETERS

MIN

NOM

8

0.80

1.65

0.35

0.25

0.40

0.05

MAX

K-

0.20

-

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.

2.

4.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Pin 1 index on exposed pad may be curved indentation or 45° chamfer

Dimensioning and tolerancing per ASME Y14.5M

Terminal-to-Exposed-Pad

3. Package is saw singulated

Terminal Center-to-Center

L2

1.55 BSC