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DMC4050SSD Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMC4050SSD Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 12 page ![]() DMC4050SSDQ Document number: DS38781 Rev. 1 - 2 2 of 12 www.diodes.com April 2016 © Diodes Incorporated DMC4050SSDQ Marking Information Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol N-Channel - Q1 P-Channel - Q2 Units Drain-Source Voltage VDSS 40 -40 V Gate-Source Voltage VGSS 20 20 Continuous Drain Current VGS = 10V (Notes 7 & 9) ID 5.8 -5.8 A TA = +70°C (Notes 7 & 9) 4.38 -4.52 (Notes 6 & 9) 4.2 -4.2 (Notes 6 & 10) 5.3 -5.3 Pulsed Drain Current VGS = 10V (Notes 8 & 9) IDM 24.1 -24.9 Continuous Source Current (Body Diode) (Notes 7 & 9) IS 2.5 -2.5 Pulsed Source Current (Body Diode) (Notes 8 & 9) ISM 24.1 -24.9 Thermal Characteristics Characteristic Symbol N-Channel - Q1 P-Channel - Q2 Unit Power Dissipation Linear Derating Factor (Notes 6 & 9) PD 1.25 10 W (Notes 6 & 10) 1.8 14.3 (Notes 7 & 9) 2.14 17.2 Thermal Resistance, Junction to Ambient (Notes 6 & 9) RθJA 100 °C/W (Notes 6 & 10) 70 (Notes 7 & 9) 58 Thermal Resistance, Junction to Lead (Notes 6 & 11) RθJL 51 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Notes: 6. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured when operating in a steady-state condition. 7. Same as Note (6), except the device is measured at t 10 sec. 8. Same as Note (6), except the device is pulsed with D = 0.02 and pulse width 300µs. 9. For a dual device with one active die. 10. For a device with two active die running at equal power. 11. Thermal resistance from junction to solder-point (at the end of the drain lead). C4050SD YY WW = Manufacturer’s Marking C4050SD = Product Type Marking Code YYWW = Date Code Marking YY or YY= Year (ex: 16 = 2016) WW = Week (01 - 53) |
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