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DMC4050SSD Datasheet(PDF) 4 Page - Diodes Incorporated

Part # DMC4050SSD
Description  40V COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
PDF  12 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMC4050SSD Datasheet(HTML) 4 Page - Diodes Incorporated

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DMC4050SSDQ
Document number: DS38781 Rev. 1 - 2
4 of 12
www.diodes.com
April 2016
© Diodes Incorporated
DMC4050SSDQ
Electrical Characteristics (Q1 N-Channel) (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 12)
Drain-Source Breakdown Voltage
BVDSS
40
—
—
V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current TJ = +25°C
IDSS
—
—
1.0
µA
VDS = 40V, VGS = 0V
Gate-Source Leakage
IGSS
—
—
±100
nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 12)
Gate Threshold Voltage
VGS(TH)
0.8
1.3
1.8
V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance
RDS(ON)
—
20
33
45
60
m
Ω
VGS = 10V, ID = 3A
VGS = 4.5V, ID = 3A
Forward Transfer Admittance
|YFS|
—
12.6
—
S
VDS = 5V, ID = 3A
Diode Forward Voltage (Note 12)
VSD
—
0.7
1.0
V
VGS = 0V, IS = 1A
DYNAMIC CHARACTERISTICS (Note 13)
Input Capacitance
CISS
—
1,790.8
—
pF
VDS = 20V, VGS = 0V,
f = 1.0MHz
Output Capacitance
COSS
—
160.6
—
pF
Reverse Transfer Capacitance
CRSS
—
120.5
—
pF
Gate Resistance
RG
—
1.03
—
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge
QG
—
37.56
—
nC
VGS = 10V, VDS = 20V,
ID = 3A
Gate-Source Charge
QGS
—
7.8
—
nC
Gate-Drain Charge
QGD
—
6.6
—
nC
Turn-On Delay Time
tD(ON)
—
8.08
—
ns
VGS = 10V, VDS = 20V,
ID = 3A
Turn-On Rise Time
tR
—
15.14
—
ns
Turn-Off Delay Time
tD(OFF)
—
24.29
—
ns
Turn-Off Fall Time
tF
—
5.27
—
ns
Electrical Characteristics (Q2 P-Channel) (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 12)
Drain-Source Breakdown Voltage
BVDSS
-40
—
—
V
VGS = 0V, ID = -250μA
Zero Gate Voltage Drain Current TJ = +25°C
IDSS
—
—
-1.0
μA
VDS = -40V, VGS = 0V
Gate-Source Leakage
IGSS
—
—
±100
nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 12)
Gate Threshold Voltage
VGS(TH)
-0.8
-1.3
-1.8
V
VDS = VGS, ID = -250μA
Static Drain-Source On-Resistance
RDS(ON)
—
28
30
45
60
m
Ω
VGS = -10V, ID = -3A
VGS = -4.5V, ID = -3A
Forward Transfer Admittance
|YFS|
—
16.6
—
S
VDS = -5V, ID = -3A
Diode Forward Voltage (Note 12)
VSD
—
-0.7
-1.0
V
VGS = 0V, IS = -1A
DYNAMIC CHARACTERISTICS (Note 13)
Input Capacitance
CISS
—
1,643.17
—
pF
VDS = -20V, VGS = 0V,
f = 1.0MHz
Output Capacitance
COSS
—
179.13
—
pF
Reverse Transfer Capacitance
CRSS
—
127.82
—
pF
Gate Resistance
RG
—
6.43
—
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge
QG
—
33.66
—
nC
VGS = -10V, VDS = -20V,
ID = -3A
Gate-Source Charge
QGS
—
5.54
—
nC
Gate-Drain Charge
QGD
—
7.30
—
nC
Turn-On Delay Time
tD(ON)
—
6.85
—
ns
VGS = -10V, VDS = -20V,
ID = -3A
Turn-On Rise Time
tR
—
14.72
—
ns
Turn-Off Delay Time
tD(OFF)
—
53.65
—
ns
Turn-Off Fall Time
tF
—
30.86
—
ns
Notes:
12. Short duration pulse test used to minimize self-heating effect.
13. Guaranteed by design. Not subject to production testing.



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