ADP3522ACP-1.8 datasheet(20/20 Pages) AD

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ADP3522

OUTLINE DIMENSIONS

32-Lead Frame Chip Scale Package [LFCSP]

5 mm

5 mm Body

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

12 MAX

0.20 REF

0.05 MAX

0.02 NOM

COPLANARITY

0.08

1.00 MAX

0.65 NOM

1.00

0.90

0.80

BOTTOM

VIEW

0.50

0.40

0.30

3.50

REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.25

3.10

2.95

PIN 1

INDICATOR

0.60 MAX

SEATING

PLANE

5.36

3.96

3.56

3.80

0.08

0.50

0.20

0.70

0.30

Dimensions shown in millimeters

Figure 11. 5 mm

5 mm LFCSP Pad Pattern

0.60

1.18

0.60

ARRAY OF 9 VIAS

0.25mm DIAMETER

0.35 m PLATING

THERMAL PAD AREA

Dimensions shown in millimeters

Figure 12. 5 mm

5 mm LFSCP Via Pattern

CREATE SOLDER PASTE

WEB FOR APPROX 80%

COVERAGE 125 MICRONS

WIDE TO SEPARATE

SOLDER PASTE AREA

THERMAL PAD AREA

Figure 13. 5 mm

5 mm LFSCP Solder Paste Mask Pattern

ADP3522ACP-1.8 Datasheet(PDF) 20 Page - Analog Devices

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