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ADPD103BCPZ Datasheet(PDF) 53 Page - Analog Devices

Part # ADPD103BCPZ
Description  TEMPERATURE AND POWER SPECIFICATIONS
PDF  53 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADPD103BCPZ Datasheet(HTML) 53 Page - Analog Devices

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ADPD103
Data Sheet
Rev. B | Page 52 of 52
OUTLINE DIMENSIONS
2.70
2.60 SQ
2.50
0.80
0.75
0.70
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
1
0.40
BSC
28
8
14
15
21
22
7
PIN 1
INDICATOR
0.45
0.40
0.35
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
PIN 1
INDICATOR
0.25
0.20
0.15
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT
TO JEDEC STANDARDS MO-220-WGGE.
4.10
4.00 SQ
3.90
0.20 MIN
Figure 31. 28-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-28-5)
Dimensions shown in millimeters
BOTTOM VIEW
(BALL SIDE UP)
A
B
C
D
E
F
0.560
0.500
0.440
1.44
1.40
1.36
2.50
2.46
2.42
1
2
3
0.300
0.260
0.220
0.40
BSC
0.300
0.225
0.235
2.00
REF
BALL A1
IDENTIFIER
SEATING
PLANE
0.230
0.200
0.170
0.330
0.300
0.270
COPLANARITY
0.05
TOP VIEW
(BALL SIDE DOWN)
END VIEW
Figure 32. 16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16-18)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
ADPD103BCPZ
−40°C to +85°C
28-Lead LFCSP_WQ
CP-28-5
ADPD103BCPZRL
−40°C to +85°C
28-Lead LFCSP_WQ
CP-28-5
ADPD103BCBZRL7
−40°C to +85°C
16-Ball WLCSP
CB-16-18
EVAL-ADPD103Z-GEN
Generic ADPD103 Evaluation Board
1
Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2015–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12722-0-2/16(B)



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