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STM32F058C8 Datasheet(PDF) 85 Page - STMicroelectronics |
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STM32F058C8 Datasheet(HTML) 85 Page - STMicroelectronics |
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85 / 104 page  DocID023402 Rev 3 85/104 STM32F058C8 STM32F058R8 STM32F058T8 Package information 100 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 UFBGA64 package information UFBGA64 is a 64-ball, 5 x 5 mm, 0.5 mm pitch ultra-fine-profile ball grid array package. Figure 31. UFBGA64 package outline 1. Drawing is not to scale. Table 63. UFBGA64 package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 A1 0.050 0.080 0.110 0.0020 0.0031 0.0043 A2 0.400 0.450 0.500 0.0157 0.0177 0.0197 A3 0.080 0.130 0.180 0.0031 0.0051 0.0071 A4 0.270 0.320 0.370 0.0106 0.0126 0.0146 |
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