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STM32F058C8 Datasheet(PDF) 95 Page - STMicroelectronics |
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STM32F058C8 Datasheet(HTML) 95 Page - STMicroelectronics |
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95 / 104 page  DocID023402 Rev 3 95/104 STM32F058C8 STM32F058R8 STM32F058T8 Package information 100 Figure 41. Recommended pad footprint for WLCSP36 package F - 0.3025 - - 0.0119 - G - 0.3515 - - 0.0138 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 68. WLCSP36 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed Table 67. WLCSP36 package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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