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STM32F745VG Datasheet(PDF) 201 Page - STMicroelectronics

Part # STM32F745VG
Description  ARM-based Cortex-M7 32b MCUFPU, 462DMIPS, up to 1MB Flash/32016 4KB RAM, USB OTG HS/FS, ethernet, 18 TIMs, 3 ADCs, 25 com itf, cam & LCD
PDF  227 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F745VG Datasheet(HTML) 201 Page - STMicroelectronics

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DocID027590 Rev 4
201/227
STM32F745xx STM32F746xx
Package information
226
Marking of engineering samples
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Figure 84. TFBGA100, 8 × 8 × 0.8mm thin fine-pitch ball grid array package
top view example
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
Table 114. TFBGA100 recommended PCB design rules (0.8 mm pitch BGA)
Dimension
Recommended values
Pitch
0.8
Dpad
0.400 mm
Dsm
0.470 mm typ (depends on the soldermask
registration tolerance)
Stencil opening
0.400 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Pad trace width
0.120 mm



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