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STM32F301C6 Datasheet(PDF) 126 Page - STMicroelectronics |
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STM32F301C6 Datasheet(HTML) 126 Page - STMicroelectronics |
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126 / 135 page ![]() Package information STM32F301x6 STM32F301x8 126/135 DocID025146 Rev 6 7.4 UFQFPN32 package information Figure 45. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must be connected. It is referred to as pin 0 in Table: Pin definitions. |
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