©2014 Silicon Storage Technology, Inc.

DS20005053B

04/14

36

4 Mbit (x16) Multi-Purpose Flash Plus

SST39VF401C / SST39VF402C / SST39LF401C / SST39LF402C

Data Sheet

Figure 28:48-ball Thin-profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm

Package Code: B3K

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-14035A Sheet 1 of 1

48-Lead Thin Fine-Pitch Ball Grid Array (B3KE/F) - 6x8 mm Body [TFBGA]

48-tfbga-B3K-6x8-450mic-5

Note:

1. Complies with JEDEC Publication 95, MO-210, variant 'AB-1', although some dimensions may be more stringent.

2. All linear dimensions are in millimeters.

3. Coplanarity: 0.12 mm

4. Ball opening size is 0.38 mm (± 0.05 mm)